Kondo, Kazuo
Copper Electrodeposition for Nanofabrication of Electronics Devices
Part I. Copper Electrodepositon and Additive Chemistry
1. Copper Electrodepositon
Masayuki Yokoi
2. Supression Effect and Additive Chemistry
Masayuki Yokoi
3. Acceleration Effect
Dale P. Barkey
4. Modeling and Simulation
Yutaka Kaneko
Part II. Copper on Chip Metallization
5. Frontiers of Cu Electrodeposition and Electroless Plating for On-chip Interconnects
James F. Rohan, Damien Thompson
6. Microstructure Evolution of Copper in Nanoscale Interconnect Features
James Kelly, Christopher Parks, James Demarest, Juntao Li, Christopher Penny
7. Direct Copper Plating
Aleksandar Radisic, Philippe M. Vereecken
Part III. Through Silicon Via and Other Methods
8. Through Silicon Via
Kazuo Kondo
9. Build-up Printed Wiring Boards (Build-up PWBs)
Kiyoshi Takagi, Toshikazu Okubo
10. Copper Foil Smooth on Both Sides for Lithium-Ion Battery
Akitoshi Suzuki, Jun Shinozaki
11. Through Hole Plating
Wei-Ping Dow
12. Erratum to: Acceleration Effect
Dale P. Barkey
Nyckelord: Chemistry, Electrochemistry, Nanotechnology, Electronics and Microelectronics, Instrumentation, Solid State Physics
- Författare
- Kondo, Kazuo
- Akolkar, Rohan N.
- Barkey, Dale P.
- Yokoi, Masayuki
- Utgivare
- Springer
- Utgivningsår
- 2014
- Språk
- en
- Utgåva
- 2014
- Serie
- Nanostructure Science and Technology
- Sidantal
- 8 sidor
- Kategori
- Naturvetenskaper
- Format
- E-bok
- eISBN (PDF)
- 9781461491767