Power Electronic Packaging

1. Challenges of Power Electronic Packaging
Yong Liu

2. Power Package Electrical Isolation Design
Yong Liu

3. Discrete Power MOSFET Package Design and Analysis
Yong Liu

4. Power IC Package Design and Analysis
Yong Liu

5. Power Module/SiP/3D/Stack/Embedded Packaging Design and Considerations
Yong Liu

6. Thermal Management, Design, and Cooling for Power Electronics
Yong Liu

7. Material Characterization for Power Electronics Packaging
Yong Liu

8. Power Package Typical Assembly Process
Yong Liu

9. Power Packaging Typical Reliability and Test
Yong Liu

10. Power Packaging Modeling and Challenges
Yong Liu

11. Power Package Thermal and Mechanical Codesign Simulation Automation
Yong Liu

12. Power Package Electrical and Multiple Physics Simulation
Yong Liu

Nyckelord: Engineering, Power Electronics, Electrical Machines and Networks, Electronics and Microelectronics, Instrumentation, Solid State Physics, Spectroscopy and Microscopy, Circuits and Systems