Pang, John Hock Lye
Lead Free Solder
Table of contents
1. Introduction
John Hock Lye Pang
2. Theory on Mechanics of Solder Materials
John Hock Lye Pang
3. Mechanical Properties and Constitutive Models
John Hock Lye Pang
4. Fatigue Life Prediction Models
John Hock Lye Pang
5. Finite Element Analysis and Design-for-Reliability
John Hock Lye Pang
6. Thermo-Mechanical Reliability Test and Analysis
John Hock Lye Pang
7. Dynamic Mechanical Reliability Test and Analysis
John Hock Lye Pang
8. Thermal Cycling Aging Effects on Board-Level Drop Test Result
John Hock Lye Pang
Nyckelord: Engineering, Electronics and Microelectronics, Instrumentation, Optical and Electronic Materials, Continuum Mechanics and Mechanics of Materials, Circuits and Systems
- Författare
- Pang, John Hock Lye
- Utgivare
- Springer
- Utgivningsår
- 2012
- Språk
- en
- Utgåva
- 1
- Sidantal
- 10 sidor
- Kategori
- Teknologi, energi, trafik
- Format
- E-bok
- eISBN (PDF)
- 9781461404637
