Gupta, Tapan
Copper Interconnect Technology
Table of contents
2. Introduction
Tapan Gupta
3. Dielectric Materials
Tapan Gupta
4. Diffusion and Barrier Layers
Tapan Gupta
5. Pattern Generation
Tapan Gupta
6. Deposition Technologies of Materials for Cu-Interconnects
Tapan Gupta
7. The Copper Damascene Process and Chemical Mechanical Polishing
Tapan Gupta
8. Conduction and Electromigration
Tapan Gupta
9. Routing and Reliability
Tapan Gupta
Nyckelord: Engineering, Electronics and Microelectronics, Instrumentation, Optical and Electronic Materials, Circuits and Systems, Nanotechnology
- Författare
- Gupta, Tapan
- Utgivare
- Springer
- Utgivningsår
- 2009
- Språk
- en
- Utgåva
- 1
- Sidantal
- 14 sidor
- Kategori
- Teknologi, energi, trafik
- Format
- E-bok
- eISBN (PDF)
- 9781441900760
