Lead-free Soldering Process Development and Reliability

Coveringthe majortopics in lead-free soldering

Lead-free Soldering Process Development and Reliabilityprovides a comprehensive discussion of all modern topics in lead-free soldering. Perfect forprocess, quality,failure analysisand reliability engineersin production industries,this reference will help practitioners address issues inresearch, development andproduction.

Among other topics, the book addresses:

· Developments in process engineering(SMT, Wave, Rework, Paste Technology)

· Lowtemperature,hightemperature andhighreliabilityalloys

· Intermetallic compounds

· PCB surface finishesandlaminates

· Underfills, encapsulants and conformal coatings

· Reliability assessments

In a regulatory environment that includes the adoption of mandatory lead-free requirements in a variety of countries, the book’sexplanations ofhigh-temperature, low-temperature, andhigh-reliabilitylead-free alloysin terms of process and reliability implicationsare invaluable to working engineers.

Lead-free Solderingtakes a forward-looking approach, with an eye towards developments likely to impact the industryin the comingyears. These will include the introduction of lead-free requirementsin high-reliability electronics products in themedical, automotive, and defense industries.The book provides practitioners in theseand other segments of theindustrywith guidelinesand informationtohelpcomplywith these requirements.

Nyckelord:

Lead-free soldering; environmental impact of soldering; environmental regulation of soldering; industrial environmental regulation; environmentally friendly soldering; process engineering; environmental requirements in process engineering;  electronics manufacturing production;emerging environmental legislation; developments in process engineering;
alloys; PCB surface finishes; PCB laminates; reliability assessments; standards