Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections

1. Introduction
Cher Ming Tan, Zhenghao Gan, Wei Li, Yuejin Hou

2. Development of Physics-Based Modeling for ULSI Interconnections Failure Mechanisms: Electromigration and Stress-Induced Voiding
Cher Ming Tan, Zhenghao Gan, Wei Li, Yuejin Hou

3. Introduction and General Theory of Finite Element Method
Cher Ming Tan, Zhenghao Gan, Wei Li, Yuejin Hou

4. Finite Element Method for Electromigration Study
Cher Ming Tan, Zhenghao Gan, Wei Li, Yuejin Hou

5. Finite Element Method for Stress-Induced Voiding
Cher Ming Tan, Zhenghao Gan, Wei Li, Yuejin Hou

6. Finite Element Method for Dielectric Reliability
Cher Ming Tan, Zhenghao Gan, Wei Li, Yuejin Hou

Nyckelord: Engineering, Quality Control, Reliability, Safety and Risk, Computational Intelligence, Electronics and Microelectronics, Instrumentation, Optical and Electronic Materials, Partial Differential Equations