Tan, Cher Ming
Electromigration Modeling at Circuit Layout Level
1. Introduction
Cher Ming Tan, Feifei He
2. 3D Circuit Model Construction and Simulation
Cher Ming Tan, Feifei He
3. Comparison of EM Performances in Circuit and Test Structures
Cher Ming Tan, Feifei He
4. Interconnect EM Reliability Modeling at Circuit Layout Level
Cher Ming Tan, Feifei He
5. Concluding Remarks
Cher Ming Tan, Feifei He
Avainsanat: Engineering, Quality Control, Reliability, Safety and Risk, Electronic Circuits and Devices, Atomic, Molecular, Optical and Plasma Physics
- Tekijä(t)
- Tan, Cher Ming
- He, Feifei
- Julkaisija
- Springer
- Julkaisuvuosi
- 2013
- Kieli
- en
- Painos
- 2013
- Sarja
- SpringerBriefs in Applied Sciences and Technology
- Sivumäärä
- 10 sivua
- Kategoria
- Tekniikka, energia, liikenne
- Tiedostomuoto
- E-kirja
- eISBN (PDF)
- 9789814451215