Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect

1. Introduction
Jie Cheng

2. Material Removal Mechanism of Cu in KIO4-Based Slurry
Jie Cheng

3. Material Removal Mechanism of Ru in KIO4-Based Slurry
Jie Cheng

4. Tribocorrosion Investigations of Cu/Ru Interconnect Structure During CMP
Jie Cheng

5. Micro-galvanic Corrosion of Cu/Ru Couple in KIO4 Solution
Jie Cheng

6. Galvanic Corrosion Inhibitors for Cu/Ru Couple During Chemical Mechanical Polishing of Ru
Jie Cheng

7. Synergetic Effect of Potassium Molybdate and Benzotriazole on the CMP of Ru and Cu in KIO4-Based Slurry
Jie Cheng

8. Conclusions and Recommendations
Jie Cheng

Avainsanat: Engineering, Manufacturing, Machines, Tools, Tribology, Corrosion and Coatings, Electronics and Microelectronics, Instrumentation