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Sharif, Ahmed

Harsh Environment Electronics: Interconnect Materials and Performance Assessment

Sharif, Ahmed - Harsh Environment Electronics: Interconnect Materials and Performance Assessment, e-kirja

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Provides in-depth knowledge on novel materials that make electronics work under high-temperature and high-pressure conditions

This book reviews the state of the art in research and development of lead-free interconnect materials for electronic packaging technology. It identifies the technical barriers to the development and manufacture of high-temperature interconnect materials to investigate into the complexities introduced by harsh conditions. It teaches the techniques adopted and the possible alternatives of interconnect materials to cope with the impacts of extreme temperatures for implementing at industrial scale. The book also examines the application of nanomaterials, current trends within the topic area, and the potential environmental impacts of material usage.

Written by world-renowned experts from academia and industry, Harsh Environment Electronics: Interconnect Materials and Performance Assessment covers interconnect materials based on silver, gold, and zinc alloys as well as advanced approaches utilizing polymers and nanomaterials in the first section. The second part is devoted to the performance assessment of the different interconnect materials and their respective environmental impact.

-Takes a scientific approach to analyzing and addressing the issues related to interconnect materials involved in high temperature electronics
-Reviews all relevant materials used in interconnect technology as well as alternative approaches otherwise neglected in other literature
-Highlights emergent research and theoretical concepts in the implementation of different materials in soldering and die-attach applications
-Covers wide-bandgap semiconductor device technologies for high temperature and harsh environment applications, transient liquid phase bonding, glass frit based die attach solution for harsh environment, and more
-A pivotal reference for professionals, engineers, students, and researchers

Harsh Environment Electronics: Interconnect Materials and Performance Assessment is aimed at materials scientists, electrical engineers, and semiconductor physicists, and treats this specialized topic with breadth and depth.

Avainsanat: harsh environment electronics, interconnect materials, lead-free interconnect materials, high-temperature interconnect materials, performance assessment, power electronics, high temperature electronics, electronic packaging technology, electronic devices in harsh environments, electronics performance issues, electronics reliability, electronics durability, electronics performance in harsh environments, electronics development, interconnect materials and environment, electronics in the cold, electronics and heat, high-performance electronic devices, harsh environment electronic development, wide-bandgap semiconductor device technology, materials science, electronics, electronics science

Toimittaja
Julkaisija
John Wiley and Sons, Inc.
Julkaisuvuosi
2019
Kieli
en
Painos
1
Sivumäärä
400 sivua
Kategoria
Tekniikka, energia, liikenne
Tiedostomuoto
E-kirja
Painetun ISBN
9783527813971

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