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Kuang, Ken

RF and Microwave Microelectronics Packaging II

Kuang, Ken - RF and Microwave Microelectronics Packaging II, e-kirja

102,30€

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ISBN: 9783319516974
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Table of contents

1. Introduction to Radio Frequency and Microwave Microelectronic Packaging
Rick Sturdivant

2. Packaging of Transmit/Receive Modules
Rick Sturdivant

3. 3D Transitions and Connections
Rick Sturdivant

4. Electromagnetic Shielding for RF and Microwave Packages
Nozad Karim

5. Design of C-Band Interdigital Filter and Compact C-Band Hairpin Bandpass Film Filter on Thin Film Substrate
Min Tan, Yang Xuan, Yong Ma, Li Li, Yonghe Zhuang

6. Research on High-Reliable Low-Loss HTCC Technology Applied in Millimeter Wave SMT Package
Pang Xueman

7. Chip Size Packaging (CSP) for RF MEMS Devices
Liang Xiao, Honglang LI

8. The Challenge in Packaging and Assembling the Advanced Power Amplifiers
Cai Liang, Jeff Burger

9. High Thermal Conductivity Materials: Aluminum Diamond, Aluminum Silicon Carbide, and Copper Diamond
Kevin Loutfy, Birol Sonuparlak, Raouf Loutfy

10. Advancement in High Thermal Conductive Graphite for Microelectronic Packaging
Wei Fan, Xiang Liu

11. Carbon Nanotubes and Graphene for Microwave/RF Electronics Packaging
Xiaoxing Lu

Avainsanat: Engineering, Electronics and Microelectronics, Instrumentation, Microwaves, RF and Optical Engineering, Circuits and Systems

Toimittaja
 
Julkaisija
Springer
Julkaisuvuosi
2017
Kieli
en
Painos
1
Sivumäärä
12 sivua
Kategoria
Tekniikka, energia, liikenne
Tiedostomuoto
E-kirja
eISBN (PDF)
9783319516974
Painetun ISBN
978-3-319-51696-7

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