3D Microelectronic Packaging

1. Introduction to 3D Microelectronic Packaging
Yan Li, Deepak Goyal

2. 3D Packaging Architectures and Assembly Process Design
Ravi Mahajan, Bob Sankman

3. Materials and Processing of TSV
Praveen Kumar, Indranath Dutta, Zhiheng Huang, Paul Conway

4. Microstructural and Reliability Issues of TSV
Praveen Kumar, Indranath Dutta, Zhiheng Huang, Paul Conway

5. Fundamentals and Failures in Die Preparation for 3D Packaging
Hualiang Shi, Erasenthiran Poonjolai

6. Direct Cu to Cu Bonding and Other Alternative Bonding Techniques in 3D Packaging
Tadatomo Suga, Ran He, George Vakanas, Antonio Manna

7. Fundamentals of Thermal Compression Bonding Technology and Process Materials for 2.5/3D Packages
Sangil Lee

8. Fundamentals of Solder Alloys in 3D Packaging
Kwang-Lung Lin

9. Fundamentals of Electromigration in Interconnects of 3D Packaging
Pilin Liu

10. Fundamentals of Heat Dissipation in 3D IC Packaging
Satish G. Kandlikar, Amlan Ganguly

11. Fundamentals of Advanced Materials and Processes in Organic Substrate Technology
Songhua Shi, Peter Tortorici

12. Die and Package Level Thermal and Thermal/Moisture Stresses in 3D Packaging: Modeling and Characterization
Liangbiao Chen, Tengfei Jiang, Xuejun Fan

13. Processing and Reliability of Solder Interconnections in Stacked Packaging
Paul Vianco

14. Interconnect Quality and Reliability of 3D Packaging
Yaodong Wang, Yingxia Liu, Menglu Li, K. N. Tu, Luhua Xu

15. Fault Isolation and Failure Analysis of 3D Packaging
Yan Li, Deepak Goyal

Avainsanat: Engineering, Electronics and Microelectronics, Instrumentation, Optical and Electronic Materials, Electronic Circuits and Devices, Microengineering, Nanotechnology and Microengineering, Metallic Materials