Dijon, Jean
Carbon Nanotubes for Interconnects
Part I. Process and Design
1. Overview of the Interconnect Problem
Ahmet Ceyhan, Azad Naeemi
2. Overview of Carbon Nanotube Interconnects
A. Srivastava, X. H. Liu, Y. M. Banadaki
3. Overview of Carbon Nanotube Processing Methods
Franz Kreupl
4. Electrical Conductivity of Carbon Nanotubes: Modeling and Characterization
Antonio Maffucci, Sergey A. Maksimenko, Giovanni Miano, Gregory Ya. Slepyan
5. Computational Studies of Thermal Transport Properties of Carbon Nanotube Materials
Leonid V. Zhigilei, Richard N. Salaway, Bernard K. Wittmaack, Alexey N. Volkov
Part II. Applications
6. Overview of Carbon Nanotubes for Horizontal On-Chip Interconnects
Jean Dijon
7. Carbon Nanotubes as Vertical Interconnects for 3D Integrated Circuits
Sten Vollebregt, Ryoichi Ishihara
8. Carbon Nanotubes as Microbumps for 3D Integration
Dominique Baillargeat, E. B. K. Tay
9. Electrothermal Modeling of Carbon Nanotube-Based TSVs
Wen-Yan Yin, Wen-Sheng Zhao, Wenchao Chen
10. Exploring Carbon Nanotubes for 3D Power Delivery Networks
Aida Todri-Sanial
11. Carbon Nanotubes for Monolithic 3D ICs
Max Marcel Shulaker, Hai Wei, Subhasish Mitra, H.-S. Philip Wong
Avainsanat: Engineering, Circuits and Systems, Processor Architectures, Electronic Circuits and Devices
- Toimittaja
- Dijon, Jean
- Maffucci, Antonio
- Todri-Sanial, Aida
- Julkaisija
- Springer
- Julkaisuvuosi
- 2017
- Kieli
- en
- Painos
- 1
- Sivumäärä
- 12 sivua
- Kategoria
- Tekniikka, energia, liikenne
- Tiedostomuoto
- E-kirja
- eISBN (PDF)
- 9783319297460
- Painetun ISBN
- 978-3-319-29744-6