Copper Electrodeposition for Nanofabrication of Electronics Devices

Part I. Copper Electrodepositon and Additive Chemistry

1. Copper Electrodepositon
Masayuki Yokoi

2. Supression Effect and Additive Chemistry
Masayuki Yokoi

3. Acceleration Effect
Dale P. Barkey

4. Modeling and Simulation
Yutaka Kaneko

Part II. Copper on Chip Metallization

5. Frontiers of Cu Electrodeposition and Electroless Plating for On-chip Interconnects
James F. Rohan, Damien Thompson

6. Microstructure Evolution of Copper in Nanoscale Interconnect Features
James Kelly, Christopher Parks, James Demarest, Juntao Li, Christopher Penny

7. Direct Copper Plating
Aleksandar Radisic, Philippe M. Vereecken

Part III. Through Silicon Via and Other Methods

8. Through Silicon Via
Kazuo Kondo

9. Build-up Printed Wiring Boards (Build-up PWBs)
Kiyoshi Takagi, Toshikazu Okubo

10. Copper Foil Smooth on Both Sides for Lithium-Ion Battery
Akitoshi Suzuki, Jun Shinozaki

11. Through Hole Plating
Wei-Ping Dow

12. Erratum to: Acceleration Effect
Dale P. Barkey

Avainsanat: Chemistry, Electrochemistry, Nanotechnology, Electronics and Microelectronics, Instrumentation, Solid State Physics