Khan, Nauman
Designing TSVs for 3D Integrated Circuits
Table of contents
1. Introduction
Nauman Khan, Soha Hassoun
2. Background
Nauman Khan, Soha Hassoun
3. Analysis and Mitigation of TSV-Induced Substrate Noise
Nauman Khan, Soha Hassoun
4. TSVs for Power Delivery
Nauman Khan, Soha Hassoun
5. Early Estimation of TSV Area for Power Delivery in 3-D ICs
Nauman Khan, Soha Hassoun
6. Carbon Nanotubes for Advancing TSV Technology
Nauman Khan, Soha Hassoun
7. Conclusions and Future Directions
Nauman Khan, Soha Hassoun
Avainsanat: Engineering, Circuits and Systems, Processor Architectures, Electronics and Microelectronics, Instrumentation
- Tekijä(t)
- Khan, Nauman
- Hassoun, Soha
- Julkaisija
- Springer
- Julkaisuvuosi
- 2013
- Kieli
- en
- Painos
- 2013
- Sarja
- SpringerBriefs in Electrical and Computer Engineering
- Sivumäärä
- 10 sivua
- Kategoria
- Tekniikka, energia, liikenne
- Tiedostomuoto
- E-kirja
- eISBN (PDF)
- 9781461455080
