Advanced Thermal Management Materials

1. Introduction to Thermal Management in Microelectronics Packaging
Guosheng Jiang, Liyong Diao, Ken Kuang

2. Requirements of Thermal Management Materials
Guosheng Jiang, Liyong Diao, Ken Kuang

3. Overview of Traditional Thermal Management Materials
Guosheng Jiang, Liyong Diao, Ken Kuang

4. Development of Advanced Thermal Management Materials
Guosheng Jiang, Liyong Diao, Ken Kuang

5. Properties of WCu, MoCu, and Cu/MoCu/Cu High-performance Heat Sink Materials and Manufacturing Technologies
Guosheng Jiang, Liyong Diao, Ken Kuang

6. Novel Methods for Manufacturing of W85-Cu Heat Sinks for Electronic Packaging Applications
Guosheng Jiang, Liyong Diao, Ken Kuang

7. Improved Manufacturing Process of Cu/Mo70-Cu/Cu Composite Heat Sinks for Electronic Packaging Applications
Guosheng Jiang, Liyong Diao, Ken Kuang

8. AlSiC Thermal Management Materials
Guosheng Jiang, Liyong Diao, Ken Kuang

9. Understanding Lasers, Laser Diodes, Laser Diode Packaging and Their Relationship to Tungsten Copper
Guosheng Jiang, Liyong Diao, Ken Kuang

10. Future Trend of Advanced Thermal Management Materials
Guosheng Jiang, Liyong Diao, Ken Kuang

Avainsanat: Energy, Energy Efficiency (incl. Buildings), Electronics and Microelectronics, Instrumentation, Engineering Thermodynamics, Heat and Mass Transfer, Metallic Materials