Advanced Flip Chip Packaging

1. Market Trends: Past, Present, and Future
Robert Lanzone

2. Technology Trends: Past, Present, and Future
Eric Perfecto, Kamalesh Srivastava

3. Bumping Technologies
Michael Töpper, Daniel Lu

4. Flip-Chip Interconnections: Past, Present, and Future
Sung-Kwon Kang, Da-Yuan Shih, William E. Bernier

5. Flip Chip Underfill: Materials, Process, and Reliability
Zhuqing Zhang, Shijian Luo, C. P. Wong

6. Conductive Adhesives for Flip-Chip Applications
Daoqiang Daniel Lu, C. P. Wong

7. Substrate Technology
Yutaka Tsukada

8. IC-Package-System Integration Design
Yiyu Shi, Yang Shang, Hao Yu, Shauki Elassaad

9. Thermal Management of Flip Chip Packages
Richard C. Chu, Robert E. Simons, Madhusudan Iyengar, Lian-Tuu Yeh

10. Thermo-mechanical Reliability in Flip-Chip Packages
Li Li, Hongtao Ma

11. Interfacial Reactions and Electromigration in Flip-Chip Solder Joints
C. E. Ho, C. R. Kao, K. N. Tu

Avainsanat: Engineering, Electronics and Microelectronics, Instrumentation, Circuits and Systems, Optical and Electronic Materials