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Kuang, Ken

RF and Microwave Microelectronics Packaging

Kuang, Ken - RF and Microwave Microelectronics Packaging, e-kirja

124,00€

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ISBN: 9781441909848
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Table of contents

1. Fundamentals of Packaging at Microwave and Millimeter-Wave Frequencies
Rick Sturdivant

2. Low-Cost High-Bandwidth Millimeter Wave Leadframe Packages
Eric A. Sanjuan, Sean S. Cahill

3. Polymeric Microelectromechanical Millimeter Wave Systems
Yiin-Kuen Fuh, Firas Sammoura, Yingqi Jiang, Liwei Lin

4. Millimeter-Wave Chip-on-Board Integration and Packaging
Edward B. Stoneham

5. Liquid Crystal Polymer for RF and Millimeter-Wave Multi-Layer Hermetic Packages and Modules
Mark P. McGrath, Kunia Aihara, Morgan J. Chen, Cheng Chen, Anh-Vu Pham

6. RF/Microwave Substrate Packaging Roadmap for Portable Devices
Mumtaz Bora

7. Ceramic Systems in Package for RF and Microwave
Thomas Bartnitzek, William Gautier, Guangwen Qu, Shi Cheng, Afshin Ziaei

8. Low-Temperature Cofired-Ceramic Laminate Waveguides for mmWave Applications
Jerry Aguirre

9. LTCC Substrates for RF/MW Application
Jian Yang, Ziliang Wang

10. High Thermal Dissipation Ceramics and Composite Materials for Microelectronic Packaging
Juan L. Sepulveda, Lee J. Vandermark

11. High Performance Microelectronics Packaging Heat Sink Materials
Jiang Guosheng, Ken Kuang, Danny Zhu

12. Technology Research on AlN 3D MCM
Zhang Hao, Cui Song, Liu Junyong

Avainsanat: Engineering, Electronics and Microelectronics, Instrumentation, Microwaves, RF and Optical Engineering, Circuits and Systems

Tekijä(t)
 
 
Julkaisija
Springer
Julkaisuvuosi
2010
Kieli
en
Painos
1
Kategoria
Tekniikka, energia, liikenne
Tiedostomuoto
E-kirja
eISBN (PDF)
9781441909848

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