Three Dimensional System Integration

1. Introduction to Three-Dimensional Integration
Antonis Papanikolaou, Dimitrios Soudris, Riko Radojcic

2. TSV-Based 3D Integration
James Burns

3. TSV Characterization and Modeling
Michele Stucchi, Guruprasad Katti, Dimitrios Velenis

4. Homogeneous 3D Integration
Robert Patti

5. 3D Physical Design
Jason Cong, Guojie Luo

6. Co-optimization of Power, Thermal, and Signal Interconnect for 3D ICs
Young-Joon Lee, Michael Healy, Sung Kyu Lim

7. PathFinding and TechTuning
Dragomir Milojevic, Ravi Varadarajan, Dirk Seynhaeve, Pol Marchal

8. 3D Stacking of DRAM on Logic
Trevor Carlson, Marco Facchini

9. Microprocessor Design Using 3D Integration Technology
Yuan Xie

10. 3D Through-Silicon Via Technology Markets and Applications
E. Jan Vardaman

Avainsanat: Architecture, Basics of Construction, Circuits and Systems