Mittal, K. L.
Adhesion in Microelectronics
This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include;
- Various theories or mechanisms of adhesion
- Surface (physical or chemical) characterization of materials as it pertains to adhesion
- Surface cleaning as it pertains to adhesion
- Ways to improve adhesion
- Unraveling of interfacial interactions using an array of pertinent techniques
- Characterization of interfaces / interphases
- Polymer-polymer adhesion
- Metal-polymer adhesion (metallized polymers)
- Polymer adhesion to various substrates
- Adhesion of thin films
- Adhesion of underfills
- Adhesion of molding compounds
- Adhesion of different dielectric materials
- Delamination and reliability issues in packaged devices
- Interface mechanics and crack propagation
- Adhesion measurement of thin films and coatings
Avainsanat: Joining, Welding and Adhesion
- Tekijä(t)
- Mittal, K. L.
- Ahsan, Tanweer
- Julkaisija
- John Wiley and Sons, Inc.
- Julkaisuvuosi
- 2014
- Kieli
- en
- Painos
- 1
- Sarja
- Adhesion and Adhesives: Fundamental and Applied Aspects
- Sivumäärä
- 368 sivua
- Kategoria
- Tekniikka, energia, liikenne
- Tiedostomuoto
- E-kirja
- eISBN (PDF)
- 9781118831359
- Painetun ISBN
- 9781118831335