Materials for Advanced Packaging

1. 3D Integration Technologies – An Overview
Rajen Chanchani

2. Advanced Bonding/Joining Techniques
Chin C. Lee, Pin J. Wang, Jong S. Kim

3. Advanced Chip-to-Substrate Connections
Paul A. Kohl, Tyler Osborn, Ate He

4. Advanced Wire Bonding Technology: Materials, Methods, and Testing
Harry K. Charles

5. Lead-Free Soldering
Ning Cheng Lee

6. Thin Die Production
Werner Kroeninger

7. Advanced Substrates: A Materials and Processing Perspective
Bernd Appelt

8. Advanced Print Circuit Board Materials
Gary Brist, Gary Long

9. Flip-Chip Underfill: Materials, Process and Reliability
Zhuqing Zhang, C. P. Wong

10. Development Trend of Epoxy Molding Compound for Encapsulating Semiconductor Chips
Shinji Komori, Yushi Sakamoto

11. Electrically Conductive Adhesives (ECAs)
Daoqiang Daniel Lu, C.P. Wong

12. Die Attach Adhesives and Films
Shinji Takeda, Takashi Masuko

13. Thermal Interface Materials
Ravi Prasher, Chia-Pin Chiu

14. Embedded Passives
Dok Won Lee, Liangliang Li, Shan X. Wang, Jiongxin Lu, C. P. Wong, Swapan K. Bhattacharya, John Papapolymerou

15. Nanomaterials and Nanopackaging
X.D. Wang, Z.L. Wang, H.J. Jiang, L. Zhu, C.P. Wong, J.E. Morris

16. Wafer Level Chip Scale Packaging
Michael Töpper

17. Microelectromechanical Systems and Packaging
Y. C. Lee

18. LED and Optical Device Packaging and Materials
Yuan-Chang Lin, Yan Zhou, Nguyen T. Tran, Frank G. Shi

19. Digital Health and Bio-Medical Packaging
Lei Mercado, James K. Carney, Michael J. Ebert, Scott A. Hareland, Rashid Bashir

Avainsanat: Material Science, Optical and Electronic Materials, Metallic Materials, Nanotechnology, Electronics and Microelectronics, Instrumentation