Greig, William J.
Integrated Circuit Packaging, Assembly and Interconnections
1. Electronic Manufacturing and the Integrated Circuit
2. Integrated Circuit Manufacturing: A Technology Resource
3. Packaging the IC—Single Chip Packaging
4. The Chip Scale Package
5. Multichip Packaging
6. Known Good Die (KGD)
7. Packaging Options—Chip on Board
8. Chip & Wire Assembly
9. Tape Automated Bonding—TAB
10. Flip Chip—The Bumping Processes
11. Flip Chip Assembly
12. HDI Substrate Manufacturing Technologies: Thin Film Technology
13. HDI Substrate Manufacturing Technologies: Thick Film Technology
14. HDI Substrate Manufacturing Technologies: Cofired Ceramic
15. Substrate Manufacturing Technologies: Organic Packages and Interconnect Substrate
Avainsanat: Engineering, Electronics and Microelectronics, Instrumentation, Circuits and Systems, Engineering Design, Optical and Electronic Materials
- Tekijä(t)
- Greig, William J.
- Julkaisija
- Springer
- Julkaisuvuosi
- 2007
- Kieli
- en
- Painos
- 1
- Sivumäärä
- 323 sivua
- Kategoria
- Tekniikka, energia, liikenne
- Tiedostomuoto
- E-kirja
- eISBN (PDF)
- 9780387339139