Lee, Y. C.
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
1. Polymer Materials Characterization, Modeling and Application
L. J. Ernst, K. M. B. Jansen, D. G. Yang, C. ’t Hof, H. J. L. Bressers, J. H. J. Janssen, G. Q. Zhang
2. Thermo-Optic Effects in Polymer Bragg Gratings
Avram Bar-Cohen, Bongtae Han, Kyoung Joon Kim
3. Photorefractive Materials and Devices for Passive Components in WDM Systems
Claire Gu, Yisi Liu, Yuan Xu, J. J. Pan, Fengqing Zhou, Liang Dong, Henry He
4. Thin Films for Microelectronics and Photonics: Physics, Mechanics, Characterization, and Reliability
David T. Read, Alex A. Volinsky
5. Carbon Nanotube Based Interconnect Technology: Opportunities and Challenges
Alan M. Cassell, Jun Li
6. Virtual Thermo-Mechanical Prototyping of Microelectronics andMicrosystems
A. Wymys?owski, G. Q. Zhang, W. D. Driel, L. J. Ernst
7. Fiber Optics Structural Mechanics and Nano-Technology Based New Generation of Fiber Coatings: Review and Extension
E. Suhir
8. Area Array Technology for High Reliability Applications
Reza Ghaffarian
9. Metallurgical Factors Behind the Reliability of High-Density Lead-Free Interconnections
Toni T. Mattila, Tomi T. Laurila, Jorma K. Kivilahti
10. Metallurgy, Processing and Reliability of Lead-Free Solder Joint Interconnections
Jin Liang, Nader Dariavach, Dongkai Shangguan
11. Fatigue Life Assessment for Lead-Free Solder Joints
Masaki Shiratori, Qiang Yu
12. Lead-Free Solder Materials: Design For Reliability
John H. L. Pang
13. Application of Moire Interferometry to Strain Analysis of PCB Deformations at Low Temperatures
Arkady Voloshin
14. Characterization of Stresses and Strains in Microelectronics and Photonics Devices Using Photomechanics Methods
Bongtae Han
15. Analysis of Reliability of IC Packages Using the Fracture Mechanics Approach
Andrew A. O. Tay
16. Dynamic Response of Micro- and Opto-Electronic Systems to Shocks and Vibrations: Review and Extension
E. Suhir
17. Dynamic Physical Reliability in Application to Photonic Materials
Dov Ingman, Tatiana Mirer, Ephraim Suhir
18. High-Speed Tensile Testing ofOptical Fibers— NewUnderstanding forReliability Prediction
Sergey Semjonov, G. Scott Glaesemann
19. The Effect of Temperature on the Microstructure Nonlinear Dynamics Behavior
Xiaoling He
20. Effect of Material’s Nonlinearity on the Mechanical Response of some Piezoelectric and Photonic Systems
Victor Birman, Ephraim Suhir
21. Analytical Thermal Stress Modeling in Physical Design for Reliability of Micro- and Opto-Electronic Systems: Role, Attributes, Challenges, Results
E. Suhir
22. Probabilistic Physical Design ofFiber-Optic Structures
Satish Radhakrishnan, Ganesh Subbarayan, Luu Nguyen
23. The Wirebonded Interconnect: AMainstay for Electronics
Harry K. Charles
24. Metallurgical Interconnections for Extreme High and Low Temperature Environments
George G. Harman
25. Design, Process, and Reliability ofWafer Level Packaging
Zhuqing Zhang, C. P. Wong
26. Passive Alignment of Optical Fibers in V-grooves with Low Viscosity Epoxy Flow
S. W. Ricky Lee, C. C. Lo
27. Fundamentals of Reliability andStress Testing
H. Anthony Chan
28. How to Make a Device into a Product:
E. Suhir
29. Micro-Deformation Analysis and Reliability Estimation of Micro-Components by Means of NanoDAC Technique
Bernd Michel, Jürgen Keller
30. Interconnect Reliability Considerations in Portable Consumer Electronic Products
Sridhar Canumalla, Puligandla Viswanadham
31. MEMS Packaging and Reliability
Y. C. Lee
32. Advances in Optoelectronic Methodology for MOEMS Testing
Ryszard J. Pryputniewicz
33. Durability of Optical Nanostructures: Laser Diode Structures and Packages, ACase Study
Ajay P. Malshe, Jay Narayan
34. Review of the Technology and Reliability Issues Arising as Optical Interconnects Migrate onto the Circuit Board
P. Misselbrook, D. Gwyer, C. Bailey, P. P. Conway, K. Williams
35. Adhesives for Micro- and Opto-Electronics Application: Chemistry, Reliability and Mechanics
D. W. Dahringer
36. Multi-Stage Peel Tests andEvaluation of Interfacial Adhesion Strength for Micro- andOpto-Electronic Materials
Masaki Omiya, Kikuo Kishimoto, Wei Yang
37. The Effect of Moisture on the Adhesion and Fracture of Interfaces in Microelectronic Packaging
Timothy P. Ferguson, Jianmin Qu
38. Highly Compliant Bonding Material for Micro- and Opto-Electronic Applications
E. Suhir, D. Ingman
39. Adhesive Bonding of Passive Optical Components
Anne-Claire Pliska, Christian Bosshard
40. Electrically Conductive Adhesives: AResearch Status Review
James E. Morris, Johan Liu
41. Electrically Conductive Adhesives
Johann Nicolics, Martin Mündlein
42. Recent Advances of Conductive Adhesives: A Lead-Free Alternative in Electronic Packaging
Grace Y. Li, C. P. Wong
43. Die Attach Quality Testing by Structure Function Evaluation
Márta Rencz, Vladimir Székely, Bernard Courtois
44. Mechanical Behavior of Flip Chip Packages under Thermal Loading
Enboa Wu, Shoulung Chen, C. Z. Tsai, Nicholas Kao
45. Stress Analysis for Processed Silicon Wafers and Packaged Micro-devices
Li Li, Yifan Guo, Dawei Zheng
Avainsanat: Engineering, Electronics and Microelectronics, Instrumentation, Optical and Electronic Materials, Engineering Design, Solid State Physics and Spectroscopy, Surfaces and Interfaces, Thin Films, Quality Control, Reliability, Safety and Risk
- Tekijä(t)
- Lee, Y. C.
- Suhir, E.
- Wong, C. P.
- Julkaisija
- Springer
- Julkaisuvuosi
- 2007
- Kieli
- en
- Painos
- 1
- Sivumäärä
- 31 sivua
- Kategoria
- Tekniikka, energia, liikenne
- Tiedostomuoto
- E-kirja
- eISBN (PDF)
- 9780387329895