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Cheng, Jie

Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect

Cheng, Jie - Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect, ebook

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ISBN: 9789811061653
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Table of contents

1. Introduction
Jie Cheng

2. Material Removal Mechanism of Cu in KIO4-Based Slurry
Jie Cheng

3. Material Removal Mechanism of Ru in KIO4-Based Slurry
Jie Cheng

4. Tribocorrosion Investigations of Cu/Ru Interconnect Structure During CMP
Jie Cheng

5. Micro-galvanic Corrosion of Cu/Ru Couple in KIO4 Solution
Jie Cheng

6. Galvanic Corrosion Inhibitors for Cu/Ru Couple During Chemical Mechanical Polishing of Ru
Jie Cheng

7. Synergetic Effect of Potassium Molybdate and Benzotriazole on the CMP of Ru and Cu in KIO4-Based Slurry
Jie Cheng

8. Conclusions and Recommendations
Jie Cheng

Keywords: Engineering, Manufacturing, Machines, Tools, Tribology, Corrosion and Coatings, Electronics and Microelectronics, Instrumentation

Author(s)
Publisher
Springer
Publication year
2018
Language
en
Edition
1
Series
Springer Theses
Category
Technology, Energy, Traffic
Format
Ebook
eISBN (PDF)
9789811061653
Printed ISBN
978-981-10-6164-6

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