Cheng, Jie
Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect
1. Introduction
Jie Cheng
2. Material Removal Mechanism of Cu in KIO
Jie Cheng
3. Material Removal Mechanism of Ru in KIO
Jie Cheng
4. Tribocorrosion Investigations of Cu/Ru Interconnect Structure During CMP
Jie Cheng
5. Micro-galvanic Corrosion of Cu/Ru Couple in KIO
Jie Cheng
6. Galvanic Corrosion Inhibitors for Cu/Ru Couple During Chemical Mechanical Polishing of Ru
Jie Cheng
7. Synergetic Effect of Potassium Molybdate and Benzotriazole on the CMP of Ru and Cu in KIO
Jie Cheng
8. Conclusions and Recommendations
Jie Cheng
Keywords: Engineering, Manufacturing, Machines, Tools, Tribology, Corrosion and Coatings, Electronics and Microelectronics, Instrumentation
- Author(s)
- Cheng, Jie
- Publisher
- Springer
- Publication year
- 2018
- Language
- en
- Edition
- 1
- Series
- Springer Theses
- Page amount
- 18 pages
- Category
- Technology, Energy, Traffic
- Format
- Ebook
- eISBN (PDF)
- 9789811061653
- Printed ISBN
- 978-981-10-6164-6