Garrou, Philip
Handbook of 3D Integration, Volume 3: 3D Process Technology
Invaluable reading for materials scientists, semiconductor physicists, and those working in the semiconductor industry, as well as IT and electrical engineers.
Keywords: Handbook of 3D Integration: 3D Process Technology, Philip Garrou, Mitsumasa Koyanagi, Peter Ramm, Drivers for 3D Integration, 2.5D Interposer Technology, Temporary Bonding and Debonding, Wafer Dicing, Stealth Dicing, Bonding and Assembly at Amkor, ASE, SCP, TSMC, 3D Reliability Issues: Protrusion, Stress/Strain, Electromigration, Underfilling, Challenges in 3D Fabrication, Implications of Stress/Strain and Metal Contamination on Thinned Die, Status of 2.5/3D Metrology
- Editor
- Garrou, Philip
- Koyanagi, Mitsumasa
- Ramm, Peter
- Publisher
- John Wiley and Sons, Inc.
- Publication year
- 2014
- Language
- en
- Edition
- 1
- Page amount
- 474 pages
- Category
- Technology, Energy, Traffic
- Format
- Ebook
- eISBN (ePUB)
- 9783527670123
- Printed ISBN
- 9783527670130