Login

Garrou, Philip

Handbook of 3D Integration: Volume 3 - 3D Process Technology

Garrou, Philip - Handbook of 3D Integration: Volume 3 - 3D Process Technology, ebook

156,25€

Ebook, ePUB with Adobe DRM
ISBN: 9783527670123
DRM Restrictions

Printing105 pages with an additional page accrued every 7 hours, capped at 105 pages
Copy to clipboard5 excerpts

Edited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book covers the intricate details of 3D process technology.
As such, the main focus is on silicon via formation, bonding and debonding, thinning, via reveal and backside processing, both from a technological and a materials science perspective. The last part of the book is concerned with assessing and enhancing the reliability of the 3D integrated devices, which is a prerequisite for the large-scale implementation of this emerging technology.
Invaluable reading for materials scientists, semiconductor physicists, and those working in the semiconductor industry, as well as IT and electrical engineers.

Keywords: Components & Devices, Handbook of 3D Integration: 3D Process Technology, Philip Garrou, Mitsumasa Koyanagi, Peter Ramm, Drivers for 3D Integration, 2.5D Interposer Technology, Temporary Bonding and Debonding, Wafer Dicing, Stealth Dicing, Bonding and Assembly at Amkor, ASE, SCP, TSMC, 3D Reliability Issues: Protrusion, Stress/Strain, Electromigration, Underfilling, Challenges in 3D Fabrication, Implications of Stress/Strain and Metal Contamination on Thinned Die, Status of 2.5/3D Metrology

Author(s)
 
 
Publisher
John Wiley and Sons, Inc.
Publication year
2014
Language
en
Edition
1
Page amount
350 pages
Category
Technology, Energy, Traffic
Format
Ebook
eISBN (ePUB)
9783527670123
Printed ISBN
9783527334667

Similar titles