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Garrou, Philip

Handbook of 3D Integration

Garrou, Philip - Handbook of 3D Integration, ebook

290,20€

Ebook, PDF with Adobe DRM
ISBN: 9783527623068
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Printing239 pages with an additional page accrued every 4 hours, capped at 239 pages
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The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two-volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects.
It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the industry. Before going on to cover processing technology and 3D structure fabrication strategies in detail. This is followed by fields of application and a look at the future of 3D integration.
The contributions come from key players in the field, from both academia and industry, including such companies as Lincoln Labs, Fraunhofer, RPI, ASET, IMEC, CEA-LETI, IBM, and Renesas.

Keywords: Components & Devices

Author(s)
 
 
Publisher
John Wiley and Sons, Inc.
Publication year
2009
Language
en
Edition
1
Page amount
798 pages
Category
Technology, Energy, Traffic
Format
Ebook
eISBN (PDF)
9783527623068
Printed ISBN
9783527320349

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