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Bakir, Muhannad S.

Handbook of 3D Integration, Volume 4: Design, Test, and Thermal Management

Bakir, Muhannad S. - Handbook of 3D Integration, Volume 4: Design, Test, and Thermal Management, ebook

168,15€

Ebook, ePUB with Adobe DRM
ISBN: 9783527697069
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Printing80 pages with an additional page accrued every 10 hours, capped at 80 pages
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This fourth volume of the landmark handbook focuses on the design, testing and thermal management of 3D-integrated devices, both from a technological and a materials science perspective.
Edited and authored by key figures from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including the particular challenges and potential. The second part is concerned with the test methods used to assess the quality and reliability of the 3D-integrated devices, while the third and final part deals with thermal management.

Keywords: Components & Devices, Semiconductor Physics, Components & Devices, Semiconductor Physics

Editor
 
 
 
 
 
Publisher
John Wiley and Sons, Inc.
Publication year
2017
Language
en
Edition
1
Page amount
265 pages
Category
Technology, Energy, Traffic
Format
Ebook
eISBN (ePUB)
9783527697069
Printed ISBN
9783527338559

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