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Khan, Nauman

Designing TSVs for 3D Integrated Circuits

Khan, Nauman - Designing TSVs for 3D Integrated Circuits, ebook

65,55€

Ebook, PDF with Adobe DRM
ISBN: 9781461455080
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Table of contents

1. Introduction
Nauman Khan, Soha Hassoun

2. Background
Nauman Khan, Soha Hassoun

3. Analysis and Mitigation of TSV-Induced Substrate Noise
Nauman Khan, Soha Hassoun

4. TSVs for Power Delivery
Nauman Khan, Soha Hassoun

5. Early Estimation of TSV Area for Power Delivery in 3-D ICs
Nauman Khan, Soha Hassoun

6. Carbon Nanotubes for Advancing TSV Technology
Nauman Khan, Soha Hassoun

7. Conclusions and Future Directions
Nauman Khan, Soha Hassoun

Keywords: Engineering, Circuits and Systems, Processor Architectures, Electronics and Microelectronics, Instrumentation

Author(s)
 
Publisher
Springer
Publication year
2013
Language
en
Edition
2013
Series
SpringerBriefs in Electrical and Computer Engineering
Category
Technology, Energy, Traffic
Format
Ebook
eISBN (PDF)
9781461455080

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