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Tong, Xingcun Colin

Advanced Materials for Thermal Management of Electronic Packaging

Tong, Xingcun Colin - Advanced Materials for Thermal Management of Electronic Packaging, ebook

213,50€

Ebook, PDF with Adobe DRM
ISBN: 9781441977595
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Table of contents

1. Thermal Management Fundamentals and Design Guides in Electronic Packaging
Xingcun Colin Tong

2. Characterization Methodologies of Thermal Management Materials
Xingcun Colin Tong

3. Electronic Packaging Materials and Their Functions in Thermal Managements
Xingcun Colin Tong

4. Monolithic Carbonaceous Materials and Carbon Matrix Composites
Xingcun Colin Tong

5. Thermally Conductive Polymer Matrix Composites
Xingcun Colin Tong

6. High Thermal Conductivity Metal Matrix Composites
Xingcun Colin Tong

7. Thermally Conductive Ceramic Matrix Composites
Xingcun Colin Tong

8. Thermal Interface Materials in Electronic Packaging
Xingcun Colin Tong

9. Materials and Design for Advanced Heat Spreader and Air Cooling Heat Sinks
Xingcun Colin Tong

10. Liquid Cooling Devices and Their Materials Selection
Xingcun Colin Tong

11. Thermoelectric Cooling Through Thermoelectric Materials
Xingcun Colin Tong

12. Development and Application of Advanced Thermal Management Materials
Xingcun Colin Tong

Keywords: Physics, Electronic Circuits and Devices, Optical and Electronic Materials, Engineering Thermodynamics, Heat and Mass Transfer, Electronics and Microelectronics, Instrumentation

Author(s)
Publisher
Springer
Publication year
2011
Language
en
Edition
1
Series
Springer Series in Advanced Microelectronics
Page amount
21 pages
Category
Natural Sciences
Format
Ebook
eISBN (PDF)
9781441977595

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