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Tong, Ho-Ming

Advanced Flip Chip Packaging

Tong, Ho-Ming - Advanced Flip Chip Packaging, ebook

175,40€

Ebook, PDF with Adobe DRM
ISBN: 9781441957689
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Table of contents

1. Market Trends: Past, Present, and Future
Robert Lanzone

2. Technology Trends: Past, Present, and Future
Eric Perfecto, Kamalesh Srivastava

3. Bumping Technologies
Michael Töpper, Daniel Lu

4. Flip-Chip Interconnections: Past, Present, and Future
Sung-Kwon Kang, Da-Yuan Shih, William E. Bernier

5. Flip Chip Underfill: Materials, Process, and Reliability
Zhuqing Zhang, Shijian Luo, C. P. Wong

6. Conductive Adhesives for Flip-Chip Applications
Daoqiang Daniel Lu, C. P. Wong

7. Substrate Technology
Yutaka Tsukada

8. IC-Package-System Integration Design
Yiyu Shi, Yang Shang, Hao Yu, Shauki Elassaad

9. Thermal Management of Flip Chip Packages
Richard C. Chu, Robert E. Simons, Madhusudan Iyengar, Lian-Tuu Yeh

10. Thermo-mechanical Reliability in Flip-Chip Packages
Li Li, Hongtao Ma

11. Interfacial Reactions and Electromigration in Flip-Chip Solder Joints
C. E. Ho, C. R. Kao, K. N. Tu

Keywords: Engineering, Electronics and Microelectronics, Instrumentation, Circuits and Systems, Optical and Electronic Materials

Author(s)
 
 
Publisher
Springer
Publication year
2013
Language
en
Edition
2013
Category
Technology, Energy, Traffic
Format
Ebook
eISBN (PDF)
9781441957689

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