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Xie, Yuan

Three Dimensional Integrated Circuit Design

Xie, Yuan - Three Dimensional Integrated Circuit Design, ebook

28,90€

Ebook, PDF with Adobe DRM
ISBN: 9781441907844
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Table of contents

1. Introduction
Kerry Bernstein

2. 3D Process Technology Considerations
Albert M. Young, Steven J. Koester

3. Thermal and Power Delivery Challenges in 3D ICs
Pulkit Jain, Pingqiang Zhou, Chris H. Kim, Sachin S. Sapatnekar

4. Thermal-Aware 3D Floorplan
Jason Cong, Yuchun Ma

5. Thermal-Aware 3D Placement
Jason Cong, Guojie Luo

6. Thermal Via Insertion and Thermally Aware Routing in 3D ICs
Sachin S. Sapatnekar

7. Three-Dimensional Microprocessor Design
Gabriel H. Loh

8. Three-Dimensional Network-on-Chip Architecture
Yuan Xie, Narayanan Vijaykrishnan, Chita Das

9. PicoServer: Using 3D Stacking Technology to Build Energy Efficient Servers
Taeho Kgil, David Roberts, Trevor Mudge

10. System-Level 3D IC Cost Analysis and Design Exploration
Xiangyu Dong, Yuan Xie

Keywords: Engineering, Electronics and Microelectronics, Instrumentation, Optical and Electronic Materials, Surfaces and Interfaces, Thin Films, Engineering, general

Author(s)
 
 
Publisher
Springer
Publication year
2010
Language
en
Edition
1
Series
Integrated Circuits and Systems
Category
Technology, Energy, Traffic
Format
Ebook
eISBN (PDF)
9781441907844

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