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Wong, C.P.

Nano-Bio- Electronic, Photonic and MEMS Packaging

Wong, C.P. - Nano-Bio- Electronic, Photonic and MEMS Packaging, ebook

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ISBN: 9781441900401
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Table of contents

1. Nanomaterials for Microelectronic and Bio-packaging
C. P. Wong, Kyoung-sik (Jack) Moon

2. Nano-conductive Adhesives for Nano-electronics Interconnection
Yi Li, Kyoung-sik (Jack) Moon, C.P. Wong

3. Biomimetic Lotus Effect Surfaces for Nanopackaging
Yonghao Xiu, C.P. Wong

4. Applications of Carbon Nanomaterials as Electrical Interconnects and Thermal Interface Materials
Wei Lin, C.P. Wong

5. Nanomaterials via NanoSpray Combustion Chemical Vapor Condensation, and Their Electronic Applications
Andrew Hunt, Yongdong Jiang, Zhiyong Zhao, Ganesh Venugopal

6. 1D Nanowire Electrode Materials for Power Sources of Microelectronics
Jaephil Cho

7. Mechanical Energy Harvesting Using Wurtzite Nanowires
Xudong Wang, Zhong Lin Wang

8. Nanolead-Free Solder Pastes for Low Processing Temperature Interconnect Applications in Microelectronic Packaging
Hongjin Jiang, Kyoung-sik (Jack) Moon, C.P. Wong

9. Introduction to Nanoparticle-Based Integrated Passives
Ranjith John, Ajay P. Malshe

10. Thermally Conductive Nanocomposites
Jan Felba

11. Physical Properties and Mechanical Behavior of Carbon Nano-tubes (CNTs) and Carbon Nano-fibers (CNFs) as Thermal Interface Materials (TIMs) for High-Power Integrated Circuit (IC) Packages: Review and Extension
Yi Zhang, Ephraim Suhir, Claire Gu

12. On-Chip Thermal Management and Hot-Spot Remediation
Avram Bar-Cohen, Peng Wang

13. Some Aspects of Microchannel Heat Transfer
Y. Joshi, X. Wei, B. Dang, K. Kota

14. Nanoprobes for Live-Cell Gene Detection
Gang Bao, Won Jong Rhee, Andrew Tsourkas

15. Packaging for Bio-micro-electro-mechanical Systems (BioMEMS) and Microfluidic Chips
Edward S. Park, Jan Krajniak, Hang Lu

16. Packaging of Biomolecular and Chemical Microsensors
Peter J. Hesketh, Xiaohui Lin

17. Nanobiosensing Electronics and Nanochemistry for Biosensor Packaging
Dasharatham G. Janagama, Rao R. Tummala

18. Molecular Dynamics Applications in Packaging
Yao Li, Jeffrey A. Hinkley, Karl I. Jacob

19. Nanoscale Deformation and Strain Analysis by AFM/DIC Technique
Y. F. Sun, John H.L. Pang

20. Nano-Scale and Atomistic-Scale Modeling of Advanced Materials
Ruo Li Dai, Wei-Hsin Liao, Chun-Te Lin, Kuo-Ning Chiang, Shi-Wei Ricky Lee

Keywords: Material Science, Nanotechnology, Electrochemistry, Electronics and Microelectronics, Instrumentation, Biomedical Engineering, Biophysics and Biological Physics

Author(s)
 
 
Publisher
Springer
Publication year
2010
Language
en
Edition
1
Category
Technology, Energy, Traffic
Format
Ebook
eISBN (PDF)
9781441900401

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