Progress in Adhesion and Adhesives, Volume 4

A solid collection of interdisciplinary review articles on the latest developments in adhesion science and adhesives technology

With the ever-increasing amount of research being published, it is a Herculean task to be fully conversant with the latest research developments in any field, and the arena of adhesion and adhesives is no exception. Thus, topical review articles provide an alternate and very efficient way to stay abreast of the state-of-the-art in many subjects representing the field of adhesion science and adhesives.

Based on the success of the preceding volumes in this series "Progress in Adhesion and Adhesives"), the present volume comprises 9 review articles published in Volume 6 (2018) of Reviews of Adhesion and Adhesives.

The subject of these reviews fall into the following general areas:

1. Adhesion to wood and wood bonds

2. Adhesive joints

3. Adhesion in microelectronic packaging

4. Surface modification

5. Contact angle, wettability and surface free energy.

The topics covered include: Adhesion phenomena in microelectronic packaging; adhesives for wood and lignocellulosic materials; adhesion to wood and lignocellulosic materials; adhesively bonded lap joints having bi-adhesive and modulus-graded bondlines; adhesion between compounded elastomers; applications of contact angle measurements in pharmaceuticals and foods; oxygen or ammonia plasma treatment of polyolefin surfaces; surface free energy determination of powders and particles; wood bonds; and dispersion adhesion forces between macroscopic objects.

Keywords: thermal, p, critical review, interface, microelectronic, solder, adhesion phenomena, interconnects