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Mittal, K. L.

Adhesion in Microelectronics

Mittal, K. L. - Adhesion in Microelectronics, ebook

193,45€

Ebook, PDF with Adobe DRM
ISBN: 9781118831359
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Printing110 pages with an additional page accrued every 7 hours, capped at 110 pages
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This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include;

  • Various theories or mechanisms of adhesion
  • Surface (physical or chemical) characterization of materials as it pertains to adhesion
  • Surface cleaning as it pertains to adhesion
  • Ways to improve adhesion
  • Unraveling of interfacial interactions using an array of pertinent techniques
  • Characterization of interfaces / interphases
  • Polymer-polymer adhesion
  • Metal-polymer adhesion  (metallized polymers)
  • Polymer adhesion to various substrates
  • Adhesion of thin films
  • Adhesion of underfills
  • Adhesion of molding compounds
  • Adhesion of different dielectric materials
  • Delamination and reliability issues in packaged devices
  • Interface mechanics and crack propagation
  • Adhesion measurement of thin films and coatings

Keywords: Joining, Welding and Adhesion

Author(s)
 
Publisher
John Wiley and Sons, Inc.
Publication year
2014
Language
en
Edition
1
Series
Adhesion and Adhesives: Fundamental and Applied Aspects
Page amount
368 pages
Category
Technology, Energy, Traffic
Format
Ebook
eISBN (PDF)
9781118831359
Printed ISBN
9781118831335

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