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Prince, Betty

Vertical 3D Memory Technologies

Prince, Betty - Vertical 3D Memory Technologies, ebook

124,00€

Ebook, ePUB with Adobe DRM
ISBN: 9781118760468
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Printing110 pages with an additional page accrued every 7 hours, capped at 110 pages
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The large scale integration and planar scaling of individual system chips is reaching an expensive limit. If individual chips now, and later terrabyte memory blocks, memory macros, and processing cores, can be tightly linked in optimally designed and processed small footprint vertical stacks, then performance can be increased, power reduced and cost contained. This book reviews for the electronics industry engineer, professional and student the critical areas of development for 3D vertical memory chips including: gate-all-around and junction-less nanowire memories, stacked thin film and double gate memories,  terrabit vertical channel and vertical gate stacked NAND flash, large scale stacking of  Resistance RAM cross-point arrays, and 2.5D/3D stacking of memory and processor chips with through-silicon-via  connections now and remote links later.

Key features:

  • Presents a review of the status and trends in 3-dimensional vertical memory chip technologies.
  • Extensively reviews advanced vertical memory chip technology and development
  • Explores technology process routes and 3D chip integration in a single reference

Keywords: Semiconductors

Author(s)
Publisher
John Wiley and Sons, Inc.
Publication year
2014
Language
en
Edition
1
Page amount
368 pages
Category
Technology, Energy, Traffic
Format
Ebook
eISBN (ePUB)
9781118760468
Printed ISBN
9781118760512

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