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Grossmann, Günter

The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects

Grossmann, Günter - The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects, ebook

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ISBN: 9780857292360
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Table of contents

1. Deformation and Fatigue of Solders
Günter Grossmann

2. Factors Affecting the Bulk Embrittlement of Pb-Free Solder Joints
K. Lambrinou

3. Thermal Fatigue Analysis
Rainer Dudek, Ellen Auerswald

4. Electrochemical Behaviour of Solder Alloys
C. Zou, C. Hunt

5. Void Formation by Kirkendall Effect in Solder Joints
M. J. M. Hermans, M. H. Biglari

6. Tin Whiskers
Antonello Vicenzo

7. Electromigration in Solder Interconnects
R. Labie

8. Impact of Black Pad and Intermetallic Layers on the Risk for Fractures in Solder Joints to Electroless Nickel/Immersion Gold
P.-E. Tegehall

9. Reliability of Electronic Assemblies Under Mechanical Shock Loading
T. T. Mattila, T. Laurila, V. Vuorinen, J. K. Kivilahti

10. Impact of Humidity and Contamination on Surface Insulation Resistance and Electrochemical Migration
P.-E. Tegehall

11. Lead-Free and Other Process Effects on Conductive Anodic Filamentation Resistance of Glass-Reinforced Epoxy Laminates
C. Zou, A. Brewin, C. Hunt

12. PCB Delamination
I. Baylakoglu, E. Hedin

13. Excessive Warpage of Large Packages During Reflow Soldering
Bart Vandevelde

14. Popcorn Cracking
Rainer Dudek

15. Thermal Capability of Components
C. Zardini, J.-Y. Deletage

Keywords: Engineering, Electronics and Microelectronics, Instrumentation, Optical and Electronic Materials, Quality Control, Reliability, Safety and Risk, Characterization and Evaluation of Materials

Author(s)
 
Publisher
Springer
Publication year
2011
Language
en
Edition
1
Category
Technology, Energy, Traffic
Format
Ebook
eISBN (PDF)
9780857292360

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