Tan, Chuan Seng
Wafer Level 3-D ICs Process Technology
2. Overview of Wafer-Level 3D ICs
Chuan Seng Tan, Ronald J. Gutmann, L. Rafael Reif
3. Monolithic 3D Integrated Circuits
Christopher Petti, S. Brad Herner, Andrew Walker
4. Stacked CMOS Technologies
Mansun Chan
5. Wafer-Bonding Technologies and Strategies for 3D ICs
Shari Farrens
6. Through-Silicon Via Fabrication, Backgrind, and Handle Wafer Technologies
Sharath Hosali, Greg Smith, Larry Smith, Susan Vitkavage, Sitaram Arkalgud
7. Cu Wafer Bonding for 3D IC Applications
Kuan-Neng Chen, Chuan Seng Tan, Andy Fan, L. Rafael Reif
8. Cu/Sn Solid–Liquid Interdiffusion Bonding
A. Munding, H. Hübner, A. Kaiser, S. Penka, P. Benkart, E. Kohn
9. An SOI-Based 3D Circuit Integration Technology
James Burns, Brian Aull, Robert Berger, Nisha Checka, Chang-Lee Chen, Chenson Chen, Pascale Gouker, Craig Keast, Jeffrey Knecht, Antonio Soares, Vyshnavi Suntharalingam, Brian Tyrrell, Keith Warner, Bruce Wheeler, Peter Wyatt, Peter Wyatt, Donna Yost
10. 3D Fabrication Options for High-Performance CMOS Technology
Anna W. Topol, Steven J. Koester, Douglas C. Tulipe, Albert M. Young
11. 3D Integration Based upon Dielectric Adhesive Bonding
Jian-Qiang Lu, Timothy S. Cale, Ronald J. Gutmann
12. Direct Hybrid Bonding
Bart Swinnen, Anne Jourdain, Piet Moor, Eric Beyne
13. 3D Memory
Robert S. Patti
14. Circuit Architectures for 3D Integration
Nisha Checka
15. Thermal Challenges of 3D ICs
Sheng-Chih Lin, Kaustav Banerjee
16. Status and Outlook
Scott K. Pozder, Robert E. Jones
Keywords: Engineering, Electronics and Microelectronics, Instrumentation, Optical and Electronic Materials, Surfaces and Interfaces, Thin Films, Engineering, general
- Author(s)
- Tan, Chuan Seng
- Gutmann, Ronald J.
- Reif, L. Rafael
- Publisher
- Springer
- Publication year
- 2008
- Language
- en
- Edition
- 1
- Series
- Integrated Circuits and Systems
- Page amount
- 14 pages
- Category
- Technology, Energy, Traffic
- Format
- Ebook
- eISBN (PDF)
- 9780387765341