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Tan, Chuan Seng

Wafer Level 3-D ICs Process Technology

Tan, Chuan Seng - Wafer Level 3-D ICs Process Technology, ebook

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ISBN: 9780387765341
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Table of contents

2. Overview of Wafer-Level 3D ICs
Chuan Seng Tan, Ronald J. Gutmann, L. Rafael Reif

3. Monolithic 3D Integrated Circuits
Christopher Petti, S. Brad Herner, Andrew Walker

4. Stacked CMOS Technologies
Mansun Chan

5. Wafer-Bonding Technologies and Strategies for 3D ICs
Shari Farrens

6. Through-Silicon Via Fabrication, Backgrind, and Handle Wafer Technologies
Sharath Hosali, Greg Smith, Larry Smith, Susan Vitkavage, Sitaram Arkalgud

7. Cu Wafer Bonding for 3D IC Applications
Kuan-Neng Chen, Chuan Seng Tan, Andy Fan, L. Rafael Reif

8. Cu/Sn Solid–Liquid Interdiffusion Bonding
A. Munding, H. Hübner, A. Kaiser, S. Penka, P. Benkart, E. Kohn

9. An SOI-Based 3D Circuit Integration Technology
James Burns, Brian Aull, Robert Berger, Nisha Checka, Chang-Lee Chen, Chenson Chen, Pascale Gouker, Craig Keast, Jeffrey Knecht, Antonio Soares, Vyshnavi Suntharalingam, Brian Tyrrell, Keith Warner, Bruce Wheeler, Peter Wyatt, Peter Wyatt, Donna Yost

10. 3D Fabrication Options for High-Performance CMOS Technology
Anna W. Topol, Steven J. Koester, Douglas C. Tulipe, Albert M. Young

11. 3D Integration Based upon Dielectric Adhesive Bonding
Jian-Qiang Lu, Timothy S. Cale, Ronald J. Gutmann

12. Direct Hybrid Bonding
Bart Swinnen, Anne Jourdain, Piet Moor, Eric Beyne

13. 3D Memory
Robert S. Patti

14. Circuit Architectures for 3D Integration
Nisha Checka

15. Thermal Challenges of 3D ICs
Sheng-Chih Lin, Kaustav Banerjee

16. Status and Outlook
Scott K. Pozder, Robert E. Jones

Keywords: Engineering, Electronics and Microelectronics, Instrumentation, Optical and Electronic Materials, Surfaces and Interfaces, Thin Films, Engineering, general

Author(s)
 
 
Publisher
Springer
Publication year
2008
Language
en
Edition
1
Series
Integrated Circuits and Systems
Category
Technology, Energy, Traffic
Format
Ebook
eISBN (PDF)
9780387765341

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