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Tu, King-Ning

Solder Joint Technology

Tu, King-Ning - Solder Joint Technology, ebook

142,60€

Ebook, PDF with Adobe DRM
ISBN: 9780387388922
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Table of contents

1. Introduction
King-Ning Tu

I. Copper—Tin Reactions

2. Copper–Tin Reactions in Bulk Samples
King-Ning Tu

3. Copper–Tin Reactions in Thin-Film Samples
King-Ning Tu

4. Copper–Tin Reactions in Flip Chip Solder Joints
King-Ning Tu

5. Kinetic Analysis of Flux-Driven Ripening of Copper–Tin Scallops
King-Ning Tu

6. Spontaneous Tin Whisker Growth: Mechanism and Prevention
King-Ning Tu

7. Solder Reactions on Nickel, Palladium, and Gold
King-Ning Tu

II. Electromigration and Thermomigration

8. Fundamentals of Electromigration
King-Ning Tu

9. Electromigration in Flip Chip Solder Joints
King-Ning Tu

10. Polarity Effect of Electromigration on Solder Reactions
King-Ning Tu

11. Ductile–to-Brittle Transition of Solder Joints Affected by Copper–Tin Reaction and Electromigration
King-Ning Tu

12. Thermomigration
King-Ning Tu

DRM-restrictions

Printing: not available
Clipboard copying: not available

Keywords: SCIENCE / Chemistry / General SCI013000

Author(s)
Publisher
Springer
Publication year
2007
Language
en
Edition
1
Category
Natural Sciences
Format
Ebook
eISBN (PDF)
9780387388922

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