Solder Joint Technology

1. Introduction
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I. Copper—Tin Reactions

2. Copper–Tin Reactions in Bulk Samples
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3. Copper–Tin Reactions in Thin-Film Samples
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4. Copper–Tin Reactions in Flip Chip Solder Joints
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5. Kinetic Analysis of Flux-Driven Ripening of Copper–Tin Scallops
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6. Spontaneous Tin Whisker Growth: Mechanism and Prevention
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7. Solder Reactions on Nickel, Palladium, and Gold
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II. Electromigration and Thermomigration

8. Fundamentals of Electromigration
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9. Electromigration in Flip Chip Solder Joints
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10. Polarity Effect of Electromigration on Solder Reactions
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11. Ductile–to-Brittle Transition of Solder Joints Affected by Copper–Tin Reaction and Electromigration
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12. Thermomigration
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DRM-restrictions

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Keywords: SCIENCE / Chemistry / General SCI013000