Khan, Nauman
Designing TSVs for 3D Integrated Circuits
Table of contents
1. Introduction
Nauman Khan, Soha Hassoun
2. Background
Nauman Khan, Soha Hassoun
3. Analysis and Mitigation of TSV-Induced Substrate Noise
Nauman Khan, Soha Hassoun
4. TSVs for Power Delivery
Nauman Khan, Soha Hassoun
5. Early Estimation of TSV Area for Power Delivery in 3-D ICs
Nauman Khan, Soha Hassoun
6. Carbon Nanotubes for Advancing TSV Technology
Nauman Khan, Soha Hassoun
7. Conclusions and Future Directions
Nauman Khan, Soha Hassoun
Keywords: Engineering, Circuits and Systems, Processor Architectures, Electronics and Microelectronics, Instrumentation
- Author(s)
- Khan, Nauman
- Hassoun, Soha
- Publisher
- Springer
- Publication year
- 2013
- Language
- en
- Edition
- 2013
- Series
- SpringerBriefs in Electrical and Computer Engineering
- Page amount
- 10 pages
- Category
- Technology, Energy, Traffic
- Format
- Ebook
- eISBN (PDF)
- 9781461455080
