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Greig, William J.

Integrated Circuit Packaging, Assembly and Interconnections

Integrated Circuit Packaging, Assembly and Interconnections

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ISBN: 9780387339139
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Table of contents

1. Electronic Manufacturing and the Integrated Circuit

2. Integrated Circuit Manufacturing: A Technology Resource

3. Packaging the IC—Single Chip Packaging

4. The Chip Scale Package

5. Multichip Packaging

6. Known Good Die (KGD)

7. Packaging Options—Chip on Board

8. Chip & Wire Assembly

9. Tape Automated Bonding—TAB

10. Flip Chip—The Bumping Processes

11. Flip Chip Assembly

12. HDI Substrate Manufacturing Technologies: Thin Film Technology

13. HDI Substrate Manufacturing Technologies: Thick Film Technology

14. HDI Substrate Manufacturing Technologies: Cofired Ceramic

15. Substrate Manufacturing Technologies: Organic Packages and Interconnect Substrate

Keywords: Engineering, Electronics and Microelectronics, Instrumentation, Circuits and Systems, Engineering Design, Optical and Electronic Materials

Author(s)
Publisher
Springer
Publication year
2007
Language
en
Edition
1
Page amount
323 pages
Category
Technology, Energy, Traffic
Format
Ebook
eISBN (PDF)
9780387339139

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