Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging

1. Polymer Materials Characterization, Modeling and Application
L. J. Ernst, K. M. B. Jansen, D. G. Yang, C. ’t Hof, H. J. L. Bressers, J. H. J. Janssen, G. Q. Zhang

2. Thermo-Optic Effects in Polymer Bragg Gratings
Avram Bar-Cohen, Bongtae Han, Kyoung Joon Kim

3. Photorefractive Materials and Devices for Passive Components in WDM Systems
Claire Gu, Yisi Liu, Yuan Xu, J. J. Pan, Fengqing Zhou, Liang Dong, Henry He

4. Thin Films for Microelectronics and Photonics: Physics, Mechanics, Characterization, and Reliability
David T. Read, Alex A. Volinsky

5. Carbon Nanotube Based Interconnect Technology: Opportunities and Challenges
Alan M. Cassell, Jun Li

6. Virtual Thermo-Mechanical Prototyping of Microelectronics andMicrosystems
A. Wymys?owski, G. Q. Zhang, W. D. Driel, L. J. Ernst

7. Fiber Optics Structural Mechanics and Nano-Technology Based New Generation of Fiber Coatings: Review and Extension
E. Suhir

8. Area Array Technology for High Reliability Applications
Reza Ghaffarian

9. Metallurgical Factors Behind the Reliability of High-Density Lead-Free Interconnections
Toni T. Mattila, Tomi T. Laurila, Jorma K. Kivilahti

10. Metallurgy, Processing and Reliability of Lead-Free Solder Joint Interconnections
Jin Liang, Nader Dariavach, Dongkai Shangguan

11. Fatigue Life Assessment for Lead-Free Solder Joints
Masaki Shiratori, Qiang Yu

12. Lead-Free Solder Materials: Design For Reliability
John H. L. Pang

13. Application of Moire Interferometry to Strain Analysis of PCB Deformations at Low Temperatures
Arkady Voloshin

14. Characterization of Stresses and Strains in Microelectronics and Photonics Devices Using Photomechanics Methods
Bongtae Han

15. Analysis of Reliability of IC Packages Using the Fracture Mechanics Approach
Andrew A. O. Tay

16. Dynamic Response of Micro- and Opto-Electronic Systems to Shocks and Vibrations: Review and Extension
E. Suhir

17. Dynamic Physical Reliability in Application to Photonic Materials
Dov Ingman, Tatiana Mirer, Ephraim Suhir

18. High-Speed Tensile Testing ofOptical Fibers— NewUnderstanding forReliability Prediction
Sergey Semjonov, G. Scott Glaesemann

19. The Effect of Temperature on the Microstructure Nonlinear Dynamics Behavior
Xiaoling He

20. Effect of Material’s Nonlinearity on the Mechanical Response of some Piezoelectric and Photonic Systems
Victor Birman, Ephraim Suhir

21. Analytical Thermal Stress Modeling in Physical Design for Reliability of Micro- and Opto-Electronic Systems: Role, Attributes, Challenges, Results
E. Suhir

22. Probabilistic Physical Design ofFiber-Optic Structures
Satish Radhakrishnan, Ganesh Subbarayan, Luu Nguyen

23. The Wirebonded Interconnect: AMainstay for Electronics
Harry K. Charles

24. Metallurgical Interconnections for Extreme High and Low Temperature Environments
George G. Harman

25. Design, Process, and Reliability ofWafer Level Packaging
Zhuqing Zhang, C. P. Wong

26. Passive Alignment of Optical Fibers in V-grooves with Low Viscosity Epoxy Flow
S. W. Ricky Lee, C. C. Lo

27. Fundamentals of Reliability andStress Testing
H. Anthony Chan

28. How to Make a Device into a Product: Accelerated Life Testing (ALT), Its Role, Attributes, Challenges, Pitfalls, and Interaction with Qualification Tests

E. Suhir

29. Micro-Deformation Analysis and Reliability Estimation of Micro-Components by Means of NanoDAC Technique
Bernd Michel, Jürgen Keller

30. Interconnect Reliability Considerations in Portable Consumer Electronic Products
Sridhar Canumalla, Puligandla Viswanadham

31. MEMS Packaging and Reliability
Y. C. Lee

32. Advances in Optoelectronic Methodology for MOEMS Testing
Ryszard J. Pryputniewicz

33. Durability of Optical Nanostructures: Laser Diode Structures and Packages, ACase Study
Ajay P. Malshe, Jay Narayan

34. Review of the Technology and Reliability Issues Arising as Optical Interconnects Migrate onto the Circuit Board
P. Misselbrook, D. Gwyer, C. Bailey, P. P. Conway, K. Williams

35. Adhesives for Micro- and Opto-Electronics Application: Chemistry, Reliability and Mechanics
D. W. Dahringer

36. Multi-Stage Peel Tests andEvaluation of Interfacial Adhesion Strength for Micro- andOpto-Electronic Materials
Masaki Omiya, Kikuo Kishimoto, Wei Yang

37. The Effect of Moisture on the Adhesion and Fracture of Interfaces in Microelectronic Packaging
Timothy P. Ferguson, Jianmin Qu

38. Highly Compliant Bonding Material for Micro- and Opto-Electronic Applications
E. Suhir, D. Ingman

39. Adhesive Bonding of Passive Optical Components
Anne-Claire Pliska, Christian Bosshard

40. Electrically Conductive Adhesives: AResearch Status Review
James E. Morris, Johan Liu

41. Electrically Conductive Adhesives
Johann Nicolics, Martin Mündlein

42. Recent Advances of Conductive Adhesives: A Lead-Free Alternative in Electronic Packaging
Grace Y. Li, C. P. Wong

43. Die Attach Quality Testing by Structure Function Evaluation
Márta Rencz, Vladimir Székely, Bernard Courtois

44. Mechanical Behavior of Flip Chip Packages under Thermal Loading
Enboa Wu, Shoulung Chen, C. Z. Tsai, Nicholas Kao

45. Stress Analysis for Processed Silicon Wafers and Packaged Micro-devices
Li Li, Yifan Guo, Dawei Zheng

Keywords: Engineering, Electronics and Microelectronics, Instrumentation, Optical and Electronic Materials, Engineering Design, Solid State Physics and Spectroscopy, Surfaces and Interfaces, Thin Films, Quality Control, Reliability, Safety and Risk